3

®

OPA177

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes

no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change

without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant

any BURR-BROWN product for use in life support devices and/or systems.

PIN CONFIGURATION

Top View

DIP/SOIC

ABSOLUTE MAXIMUM RATINGS

ELECTROSTATIC

DISCHARGE SENSITIVITY

Any integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. ESD can cause damage ranging

from subtle performance degradation to complete device

failure. Precision integrated circuits may be more suscep-

tible to damage because very small parametric changes

could cause the device not to meet published specifications.

Burr-Brown’s standard ESD test method consists of five

1000V positive and negative discharges (100pF in series

with 1.5k

Ω) applied to each pin.

Failure to observe proper handling procedures could result

in small changes to the OPA177’s input bias current.

1

2

3

4

8

7

6

5

Offset Trim

–In

+In

V–

Offset Trim

V+

V

No Internal Connection

O

Power Supply Voltage .......................................................................

±22V

Differential Input Voltage ...................................................................

±30V

Input Voltage .......................................................................................

±V

S

Output Short Circuit ................................................................. Continuous

Operating Temperature:

Plastic DIP (P), SO-8 (S) .............................................. –40

°C to +85°C

θ

θ

Storage Temperature:

Plastic DIP (P), SO-8 (S) ............................................ –65

°C to +125°C

Junction Temperature .................................................................... +150

°C

Lead Temperature (soldering, 10s) P packages ........................... +300

°C

(soldering, 3s) S package ............................... +260

°C

PACKAGE

DRAWING

TEMPERATURE

PRODUCT

PACKAGE

RANGE

OPA177FP

8-Pin Plastic DIP

006

–40

°C to +85°C

OPA177GP

8-Pin Plastic DIP

006

–40

°C to +85°C

OPA177GS

SO-8 Surface-Mount

182

–40

°C to +85°C

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.

PACKAGE/ORDERING INFORMATION