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PLL1700E/2K Datasheet(PDF) 2 Page - Texas Instruments |
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PLL1700E/2K Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 15 page ![]() PLL1700 2 SBOS096A www.ti.com PIN ASSIGNMENTS PIN CONFIGURATION TOP VIEW SSOP PACKAGE INFORMATION(1) SPECIFIED TEMPERATURE PACKAGE PRODUCT PACKAGE RANGE DESIGNATOR PLL1700E 20-Lead SSOP –25 °C to +85°CDB NOTE: (1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web site at www.ti.com. ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage (+VDD, +VDDP, +VDDB) .............................................. +6.5V Supply Voltage Differences (+VDD, +VDDP) ....................................... ±0.1V GND Voltage Differences: GND, GNDP, GNDB ............................... ±0.1V Digital Input Voltage ................................................. –0.3V to (VDD + 0.3V) Digital Output Voltage ............................................ –0.3V to (VDDB + 0.3V) Input Current (any pins except supply pins) ................................... ±10mA Power Dissipation .......................................................................... 300mW Operating Temperature Range ......................................... –25 °C to +85°C Storage Temperature ...................................................... –55 °C to +125°C Lead Temperature (soldering, 5s) .................................................. +260 °C Package Temperature (IR reflow, 10s) .......................................... +235 °C NOTE: (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. PIN NAME I/O FUNCTION 1 ML/SR0 IN Latch Enable for Software Mode/Sampling Rate Selection for Hardware Mode. When MODE pin is LOW, ML is selected.(1) 2 MODE IN Mode Control Select. When this pin is HIGH, device is operated in hardware mode using SR0 (pin 1), FS0 (pin 19), and FS1 (pin 20). When this pin is LOW, device is operated in software mode by three-wire interface using ML (pin 1), MD (pin 19) and MC (pin 20).(1) 3VDD — Digital Power Supply, +5V. 4 GND — Digital Ground. 5 XT2 — 27MHz Crystal. When an external 27MHz clock is applied to XT1 (pin 6), this pin must be connected to GND. 6 XT1 IN 27MHz Oscillator Input/External 27MHz Input. 7 GNDP — Ground for PLL. 8VDDP — Power Supply for PLL, +5V. 9 RSV — Reserved. Must be left open. 10 MCKO OUT 27MHz Output. 11 MCKO OUT Inverted 27MHz Output. 12 SCKO1 OUT Fixed 33.8688MHz Clock Output. 13 SCKO4 OUT 768fS Clock Output. 14 SCKO2 OUT 256fS Clock Output. 15 GNDB — Digital Ground for VDDB. 16 VDDB — Digital Power Supply for Clock Output Buffers, +3.3V. 17 SCKO3 OUT 384fS Output. This output has been optimized for the lowest jitter and should be connected to the audio DAC(s). 18 RST IN Reset. When this pin is LOW, device is held in reset.(1) 19 MD/FS0 IN Serial Data Input for Software Mode/Sampling Frequency Selection for Hardware Mode. When MODE pin is LOW, MD is selected.(1) 20 MC/FS1 IN Shift Clock Input for Software Mode/Sampling Frequency Selection for Hardware Mode. When MODE pin is LOW, MC is selected.(1) NOTE: (1) Schmitt-trigger input with internal pull-down resistors. ML/SR0 MODE V DD GND XT2 XT1 GNDP V DDP RSV MCKO MC/FS1 MD/FS0 RST SCKO3 V DDB GNDB SCKO2 SCKO4 SCKO1 MCKO 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 PLL1700E ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to ob- serve proper handling and installation procedures can cause damage. ESD damage can range from subtle performance deg- radation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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