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PLL1700E/2K Datasheet(PDF) 2 Page - Texas Instruments

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Part # PLL1700E/2K
Description  MULTI-CLOCK GENERATOR
PDF  15 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

PLL1700E/2K Datasheet(HTML) 2 Page - Texas Instruments

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PLL1700
2
SBOS096A
www.ti.com
PIN ASSIGNMENTS
PIN CONFIGURATION
TOP VIEW
SSOP
PACKAGE INFORMATION(1)
SPECIFIED
TEMPERATURE
PACKAGE
PRODUCT
PACKAGE
RANGE
DESIGNATOR
PLL1700E
20-Lead SSOP
–25
°C to +85°CDB
NOTE: (1) For the most current package and ordering information, see the
Package Option Addendum at the end of this data sheet, or see the TI web
site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Supply Voltage (+VDD, +VDDP, +VDDB) .............................................. +6.5V
Supply Voltage Differences (+VDD, +VDDP) ....................................... ±0.1V
GND Voltage Differences: GND, GNDP, GNDB ...............................
±0.1V
Digital Input Voltage ................................................. –0.3V to (VDD + 0.3V)
Digital Output Voltage ............................................ –0.3V to (VDDB + 0.3V)
Input Current (any pins except supply pins) ...................................
±10mA
Power Dissipation .......................................................................... 300mW
Operating Temperature Range ......................................... –25
°C to +85°C
Storage Temperature ...................................................... –55
°C to +125°C
Lead Temperature (soldering, 5s) .................................................. +260
°C
Package Temperature (IR reflow, 10s) .......................................... +235
°C
NOTE: (1) Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
PIN
NAME
I/O
FUNCTION
1
ML/SR0
IN
Latch Enable for Software Mode/Sampling Rate
Selection for Hardware Mode. When MODE pin
is LOW, ML is selected.(1)
2
MODE
IN
Mode Control Select. When this pin is HIGH,
device is operated in hardware mode using SR0
(pin 1), FS0 (pin 19), and FS1 (pin 20). When
this pin is LOW, device is operated in software
mode by three-wire interface using ML (pin 1),
MD (pin 19) and MC (pin 20).(1)
3VDD
—
Digital Power Supply, +5V.
4
GND
—
Digital Ground.
5
XT2
—
27MHz Crystal. When an external 27MHz clock
is applied to XT1 (pin 6), this pin must be
connected to GND.
6
XT1
IN
27MHz Oscillator Input/External 27MHz Input.
7
GNDP
—
Ground for PLL.
8VDDP
—
Power Supply for PLL, +5V.
9
RSV
—
Reserved. Must be left open.
10
MCKO
OUT
27MHz Output.
11
MCKO
OUT
Inverted 27MHz Output.
12
SCKO1
OUT
Fixed 33.8688MHz Clock Output.
13
SCKO4
OUT
768fS Clock Output.
14
SCKO2
OUT
256fS Clock Output.
15
GNDB
—
Digital Ground for VDDB.
16
VDDB
—
Digital Power Supply for Clock Output Buffers,
+3.3V.
17
SCKO3
OUT
384fS Output. This output has been optimized
for the lowest jitter and should be connected to
the audio DAC(s).
18
RST
IN
Reset. When this pin is LOW, device is held in
reset.(1)
19
MD/FS0
IN
Serial Data Input for Software Mode/Sampling
Frequency Selection for Hardware Mode. When
MODE pin is LOW, MD is selected.(1)
20
MC/FS1
IN
Shift Clock Input for Software Mode/Sampling
Frequency Selection for Hardware Mode. When
MODE pin is LOW, MC is selected.(1)
NOTE: (1) Schmitt-trigger input with internal pull-down resistors.
ML/SR0
MODE
V
DD
GND
XT2
XT1
GNDP
V
DDP
RSV
MCKO
MC/FS1
MD/FS0
RST
SCKO3
V
DDB
GNDB
SCKO2
SCKO4
SCKO1
MCKO
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
PLL1700E
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to ob-
serve proper handling and installation procedures can
cause damage.
ESD damage can range from subtle performance deg-
radation to complete device failure. Precision integrated
circuits may be more susceptible to damage because
very small parametric changes could cause the device
not to meet its published specifications.



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