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MSK5805RH Datasheet(PDF) 4 Page - M.S. Kennedy Corporation |
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MSK5805RH Datasheet(HTML) 4 Page - M.S. Kennedy Corporation |
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4 / 11 page ![]() VOUT 1.265 VOUT=1.265(1+R1/R2) OUTPUT VOLTAGE SELECTION As noted in the above typical applications circuit, the formula for output voltage selection is A good starting point for this output voltage selection is to set R2=1K. By rearranging the formula it is simple to calculate the final R1 value. RθSA= - 7.5°C/W - 0.15°C/W APPLICATION NOTES CONT'D 4 R1 R2 1+ VOUT=1.265 -1 R1=R2 TYPICAL APPLICATIONS CIRCUIT THERMAL LIMITING The MSK5805RH control circuitry has a thermal shutdown temperature of approximately 150°C. This thermal shutdown can be used as a protection feature, but for continuous op- eration, the junction temperature of the pass transistor must be maintained below 150°C. Proper heat sink selection is essential to maintain these conditions. Exceeding the ther- mal limit activates the latch feature of the MSK5805RH. See LATCH pin description for instructions to reset the latch or disable the latch feature. Radiation performance curves for TID testing will be gener- ated for all radiation testing performed by MSK. These curves show performance trends throughout the TID test process and can be located in the MSK5805RH radiation test report. The complete radiation test report will be available in the RAD HARD PRODUCTS section on the MSK website. TOTAL DOSE RADIATION TEST PERFORMANCE The MSK5805RH requires less starup current than other RH1573 based regulators in this series. LDO regulators sink increased current during startup to bring up the output volt- age. The MSK5805RH was designed to require less starup current making it ideal for lower current applications. The startup current can be further reduced by placing a resistor (RADJ) between the LADJ pins for lower current applications. The use of RADJ decreases the saturated start up current and the current limit of the device. Reference the "Current Limit vs. RADJ" graph and "Saturated Start Up Current vs. Input Volatge" graph in the typical performance curves section of this data sheet. See AN 024 "Understanding Start Up Surge Current With MS Kennedy's RH1573 based Rad Hard LDO Regulators" in the application notes section of MSK's web site for additional information. http://www.anaren.com/msk START UP CURRENT 8548-111 Rev. F 5/15 HEAT SINK SELECTION To select a heat sink for the MSK5805RH, the following formula for convective heat flow may be used. Governing Equation: TJ = PD X (RθJC + RθCS + RθSA) + TA Where TJ = Junction Temperature PD = Total Power Dissipation RθJC = Junction to Case Thermal Resistance RθCS = Case to Heat Sink Thermal Resistance RθSA = Heat Sink to Ambient Thermal Resistance TA = Ambient Temperature Power Dissipation=(VIN-VOUT) x IOUT Next, the user must select a maximum junction tempera- ture. The absolute maximum allowable junction temperature is 150°C. The equation may now be rearranged to solve for the required heat sink to ambient thermal resistance (RθSA). Example: An MSK5805RH is connected for VIN=+5V and VOUT- =+3.3V. IOUT is a continuous 0.5A DC level. The ambient temperature is +25°C. The maximum desired junction tem- perature is +125°C. RθJC=7.5°C/W and RθCS=0.15°C/W for most thermal greases Power Dissipation=(5V-3.3V) x (0.5A) =0.85Watts Solve for RθSA: 125°C - 25°C 0.85W = 110°C/W In this example, a heat sink with a thermal resistance of no more than 110°C/W must be used to maintain a junction temperature of no more than 125°C. |
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