ADF4356BCPZ datasheet(35/35 Pages) AD

35 / 35 page

Data Sheet

ADF4356

Rev. 0 | Page 35 of 35

OUTLINE DIMENSIONS

0.50

0.40

0.30

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.25 MIN

3.75

3.60 SQ

3.55

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5.

Figure 45. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.75 mm Package Height

(CP-32-12)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADF4356BCPZ

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-12

ADF4356BCPZ-RL7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP]

CP-32-12

EV-ADF4356SD1Z

Evaluation Board

Z = RoHS Compliant Part.

registered trademarks are the property of their respective owners.

D15084-0-10/16(0)

ADF4356BCPZ Datasheet(PDF) 35 Page - Analog Devices

ADF4356BCPZ Datasheet(HTML) 35 Page - Analog Devices

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