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STM32F098CC Datasheet(PDF) 55 Page - STMicroelectronics |
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STM32F098CC Datasheet(HTML) 55 Page - STMicroelectronics |
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55 / 128 page ![]() DocID026967 Rev 4 55/128 STM32F098CC STM32F098RC STM32F098VC Electrical characteristics 99 6.3 Operating conditions 6.3.1 General operating conditions 6.3.2 Operating conditions at power-up / power-down The parameters given in Table 24 are derived from tests performed under the ambient temperature condition summarized in Table 23. Table 23. General operating conditions Symbol Parameter Conditions Min Max Unit fHCLK Internal AHB clock frequency - 0 48 MHz fPCLK Internal APB clock frequency - 0 48 VDD Standard operating voltage - 1.65 1.95 V VDDIO2 I/O supply voltage Must not be supplied if VDD is not present 1.65 3.6 V VDDA Analog operating voltage (ADC and DAC not used) Must have a potential equal to or higher than VDD VDD 3.6 V Analog operating voltage (ADC and DAC used) 2.4 3.6 VBAT Backup operating voltage - 1.65 3.6 V VIN I/O input voltage TC and RST I/O –0.3 VDDIOx+0.3 V TTa and POR I/O –0.3 VDDA+0.3(1) FT and FTf I/O –0.3 5.2(1) PD Power dissipation at TA = 85 °C for suffix 6 or TA = 105 °C for suffix 7(2) UFBGA100 - 364 mW LQFP100 - 476 LQFP64 - 455 WLCSP64 - 377 UFBGA64 - 308 LQFP48 - 370 UFQFPN48 - 625 TA Ambient temperature for the suffix 6 version Maximum power dissipation –40 85 °C Low power dissipation(3) –40 105 Ambient temperature for the suffix 7 version Maximum power dissipation –40 105 °C Low power dissipation(3) –40 125 1. For operation with a voltage higher than VDDIOx + 0.3 V, the internal pull-up resistor must be disabled. 2. If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax. See 3. In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.8: Thermal characteristics ). |
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