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STM32F098CC Datasheet(PDF) 100 Page - STMicroelectronics |
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STM32F098CC Datasheet(HTML) 100 Page - STMicroelectronics |
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100 / 128 page  Package information STM32F098CC STM32F098RC STM32F098VC 100/128 DocID026967 Rev 4 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 UFBGA100 package information UFBGA100 is a 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra-fine-profile ball grid array package. Figure 33. UFBGA100 package outline 1. Drawing is not to scale. Table 68. UFBGA100 package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A - - 0.600 - - 0.0236 A1 - - 0.110 - - 0.0043 A2 - 0.450 - - 0.0177 - A3 - 0.130 - - 0.0051 0.0094 A4 - 0.320 - - 0.0126 - |
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