DocID022192 Rev 3

7/10

ESDAVLC8-4BN4

Recommendation on PCB assembly

3

Recommendation on PCB assembly

3.1

Stencil opening design

Reference design

•

Stencil opening thickness: 100 µm

•

Stencil opening for leads: Opening to footprint ratio is 100%.

Figure 17. Recommended stencil window position

3.2

Solder paste

1.

Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2.

“No clean” solder paste is recommended.

3.

Offers a high tack force to resist component movement during high speed.

4.

Solder paste with fine particles: powder particle size is 20-45 µm.

180 µm

Footprint

Footprint

T=100 µm and opening

ratio is 100%

580 µm

Stencil window