DAC38RF83IAAV datasheet(13/155 Pages) TI1

13 / 155 page

DAC38RF80, DAC38RF83, DAC38RF84

DAC38RF85, DAC38RF90, DAC38RF93

www.ti.com

SLASEA3C – DECEMBER 2016 – REVISED JULY 2017

DAC38RF83 DAC38RF93

Submit Documentation Feedback

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Measured with respect to AGND or DGND.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply Voltage Range(2)

VDDDAC1, VDDDIG1, VDDL1_1, VDDL2_1,

VDDCLK1, VDDT1, VDDCLK1, VDDTX1, VDDE1

–0.3

1.3

VDDR18, VDDIO18, VDDS18, VDDAPLL18,

VDDOUT18, VDDA18, VDDAVCO18, VDDTX18

–0.3

2.45

VEE18N

–2

0.3

Voltage between AGND and DGND

–0.3

0.3

Pin Voltage Range(2)

RX[0..7]+/-

–0.5

VDDDIG1 + 0.5 V

SDEN, SCLK, SDIO, SDO, TXENABLE, ALARM,

RESET, SLEEP, TMS, TCLK, TDI, TDO, TRST,

TESTMODE, GPI0, GPI1, GPO0, GPO1

–0.5

VDDIO + 0.5 V

CLKOUT+/-

–0.5

VDDTX18 + 0.5 V

DACCLK+/-, SYSREF+/-, DACCLKSE

–0.5

VDDCLK1 + 0.5 V

SYNC0+/-, SYNC1+/-

–0.5

VDDS18 + 0.5 V

VOUT1+/-, VOUT2+/-

–0.5

VDDAOUT18 + 0.5 V

RBIAS, EXTIO, ATEST

–0.5

VDDAOUT18 + 0.5 V

IFORCE, VSENSE

–0.5

VDDDIG1 + 0.5 V

AMUX1, AMUX0

–0.5

VDDT1 + 0.5 V

Peak input current (any input)

Peak total input current (all inputs)

–30

Junction temperature TJ

150

°C

Operating free-air temperature, TA

–40

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

Charged-device model (CDM), per JEDEC specification JESD22-

C101(2)

±250

(1)

Prolonged use at this junction temperature may increase the device failure-in-time (FIT) rate

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Recommended operating temperature

105

°C

Maximum rated operating junction temperature(1)

125

°C

Recommended free-air temperature

–40

°C

Supply Voltage Range

VDDA18, VDDAPLL18, VDDS18, VDDIO18, VDDR18,

VDDAPLL18, VDDOUT18, VDDAVCO18

1.71

1.8

1.89

VDDDIG1 VDDA1, VDDT1, VDDAPLL1, VDDCLK1, VDDL1_1,

VDDL2_1, VDDTX1, VDDE1

0.95

1.05

VEE18N

-1.89

-1.8

-1.71

DAC38RF83IAAV Datasheet(PDF) 13 Page - Texas Instruments

DAC38RF83IAAV Datasheet(HTML) 13 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL