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Version 1.3 | 25 Sep 2017 | 31007AEN

PixArt Imaging Inc. http://www.pixart.com

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PAH8002EP-2P Product Datasheet

Low Power Optical Heart Rate Detection Chip

PixArt Imaging Inc.

4.5

Recommend Guideline for PCB Assembly

Recommended vendor and type for Pb-free solder paste

 Almit LFM-48W TM-HP

 Senju M705-GRN360-K

IR Reflow Soldering Profile can be refer to Figure 11. IR Reflow Soldering Profile.

Temperature profile is the most important control in reflow soldering. It must be fine-tuned to establish a robust process.

The typical recommended IR reflow profile is:

Figure 11. IR Reflow Soldering Profile

Note:

(1) Average Ramp-up Rate (30℃ to preheat zone): 1.5~2.5℃/Sec

(2) Preheat zone:

(2.1) Temperature ramp from 170~200℃

(2.2) Exposure time: 90 +/- 30 sec

(3) Melting zone:

(3.1) Melting area temperature > 220℃ for at least 30~50sec

(3.2) Peak temperature: 245℃

MS Level: MS Level 3