ADUCM310 datasheet(18/28 Pages) AD

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Data Sheet

ADuCM310

Rev. B Page 17 of 27

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 8.

Parameter

Rating

AVDD to AGNDx

AVNEG to AGNDx

VDACVDD to AGNDx

IOVDDx to DGNDx

Digital Input Voltage to DGNDx

Digital Output Voltage to DGNDx

Analog Inputs to AGNDx

Total Positive GPIO Pins Current

Total Negative GPIO Pins Current

IDAC3 Pull-Down Voltage

IDAC3 Pull-Down Current

Operating Temperature Range

Storage Temperature Range

Junction Temperature

−0.3 V to +3.96 V

−5.5 V to +0.3 V

−0.3 V to +5.5 V

−0.3 V to +3.96 V

−0.3 V to IOVDDx + 0.3 V

−0.3 V to AVDD + 0.3 V

0 mA to 30 mA

−30 mA to 0 mA

AVNEG − 0.3 V

−100 mA

−40°C to +85°C

−65°C to +150°C

150°C

ESD Rating, All Pins

Human Body Model (HBM)

1 kV

Field-Induced Charged Device

Model (FICDM)

1.25 kV

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 9. Thermal Resistance

Package Type

θJA

θJC

Unit

112-Ball CSP_BGA

44.5

°C/W

ESD CAUTION

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