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PCF8562 Datasheet(PDF) 35 Page - NXP Semiconductors

Part # PCF8562
Description  Universal LCD driver for low multiplex rates
PDF  36 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PCF8562 Datasheet(HTML) 35 Page - NXP Semiconductors

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November 22, 2004
35
Philips Semiconductors
Preliminary specification
Universal LCD driver
for low multiplex rates
PCF8562
17 DISCLAIMERS
Life support applications
⎯ These products are not designed for use in life support appliances, devices, or systems
where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify
Philips Semiconductors for any damages resulting from such application.
Right to make changes
⎯ Philips Semiconductors reserves the right to make changes in the products - including
circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance.
When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer
Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use
of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products,
and makes no representations or warranties that these products are free from patent, copyright, or mask work right
infringement, unless otherwise specified.
Bare die
⎯ All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for
a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be
separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips
Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die.
Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems
after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify
their application in which the die is used.
18 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.



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