OPA2991IDDFR datasheet(11/77 Pages) TI

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6 Specifications

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

Supply voltage, VS = (V+) – (V–)

Signal input pins

Common-mode voltage (3)

(V–) – 0.5

(V+) + 0.5

Differential voltage (3)

VS + 0.2

Current (3)

–10

Output short-circuit (2)

Continuous

Operating ambient temperature, TA

–55

150

°C

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Operating the device beyond the ratings listed under Absolute Maximum Ratings will cause permanent damage to the device. These

are stress ratings only, based on process and design limitations, and this device has not been designed to function outside the

conditions indicated under Recommended Operating Conditions. Exposure to any condition outside Recommended Operating

Conditions for extended periods, including absolute-maximum-rated conditions, may affect device reliability and performance.

(2)

Short-circuit to ground, one amplifier per package. This device has been designed to limit electrical damage due to excessive output

current, but extended short-circuit current, especially with higher supply voltage, can cause excessive heating and eventual thermal

destruction. See the Thermal Protection section for more information.

(3)

Input pins are diode-clamped to the power-supply rails. Input signals that may swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged device model (CDM), per JEDEC specification JESD22-C101 (2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, (V+) – (V–)

2.7

Input voltage range

(V–) – 0.1

(V+) + 0.1

VIH

High level input voltage at shutdown pin (amplifier enabled)

1.1

(V+)

VIL

Low level input voltage at shutdown pin (amplifier disabled)

(V–)

0.2

Specified temperature

–40

125

°C

6.4 Thermal Information for Single Channel

THERMAL METRIC (1)

OPA991, OPA991S

UNIT

DBV (2)

(SOT-23)

DCK (2)

(SC70)

DRL (2)

(SOT-553)

5 PINS

6 PINS

5 PINS

6 PINS

RθJA

Junction-to-ambient thermal resistance

185.7

167.8

202.6

TBD

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

108.2

107.9

101.5

TBD

°C/W

RθJB

Junction-to-board thermal resistance

54.5

49.7

47.8

TBD

°C/W

ψJT

Junction-to-top characterization parameter

31.2

33.9

18.8

TBD

°C/W

ψJB

Junction-to-board characterization parameter

54.2

49.5

47.4

TBD

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

www.ti.com

OPA991, OPA2991, OPA4991

SBOS969D – OCTOBER 2019 – REVISED JULY 2020

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