STM32G031F6 datasheet(46/117 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32G031x4/x6/x8

46/117

DS12992 Rev 2

5.3

Operating conditions

5.3.1

General operating conditions

Table 20. Thermal characteristics

Symbol

Ratings

Value

Unit

TSTG

Storage temperature range

–65 to +150

°C

Maximum junction temperature

150

°C

Table 21. General operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

fHCLK

Internal AHB clock frequency

MHz

fPCLK

Internal APB clock frequency

VDD

Standard operating voltage

1.7(1)

3.6

VDDA

Analog supply voltage

For ADC operation

1.62

3.6

For VREFBUF operation

2.4

3.6

VBAT

Backup operating voltage

1.55

3.6

VIN

I/O input voltage

-0.3

Min(VDD + 3.6, 5.5)(2)

Ambient temperature(3)

Suffix 6(4)

-40

°C

Suffix 7(4)

-40

105

Suffix 3(4)

-40

125

Junction temperature

Suffix 6(4)

-40

105

°C

Suffix 7(4)

-40

125

Suffix 3(4)

-40

130

1. When RESET is released functionality is guaranteed down to VPDR min.

2. For operation with voltage higher than VDD +0.3 V, the internal pull-up and pull-down resistors must be disabled.

3. The TA(max) applies to PD(max). At PD < PD(max) the ambient temperature is allowed to go higher than TA(max) provided

that the junction temperature TJ does not exceed TJ(max). Refer to Section 6.9: Thermal characteristics.

4. Temperature range digit in the order code. See Section 7: Ordering information.

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