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STM32G031F6 Datasheet(PDF) 108 Page - STMicroelectronics |
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STM32G031F6 Datasheet(HTML) 108 Page - STMicroelectronics |
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108 / 117 page  Package information STM32G031x4/x6/x8 108/117 DS12992 Rev 2 samples to run a qualification activity. 6.7 WLCSP18 package information WLCSP18 is a 18-ball, 1.86 x 2.14 mm wafer-level chip-scale package with 0.4 mm pitch. Figure 50. WLCSP18 package outline 1. Drawing is not to scale. 2. Dimension is measured at the maximum ball diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the ball. 4. Ball position designation per JESD 95-1, SPP-010. Table 77. WLCSP18 package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A(2) - - 0.59 - - 0.023 A1 - 0.18 - - 0.007 - F G e1 A1 BALL LOCATION e2 E e e D aaa (4x) BOTTOM VIEW BUMP A1 A2 A DETAIL A bbb Z SIDE VIEW Z b (36x) ccc X ZY ccc Z ccc Z A3 FRONT VIEW DETAIL A ROTATED 90 SEATING PLANE B06E_WLCSP18_DIE466_ME_V1 1 3 5 72 4 6 A B C D E TOP VIEW |
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