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AF31 Datasheet(PDF) 6 Page - 3M Electronics

Part # AF31
Description  3M Scotch-WeldTM Structural Adhesive Film
PDF  15 Pages
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Manufacturer  3M [3M Electronics]
Direct Link  http://www.3m.com
Logo 3M - 3M Electronics

AF31 Datasheet(HTML) 6 Page - 3M Electronics

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Scotch-WeldTM
Structural Adhesive Film
AF 31
- 6 -
6. Heat aging of 3M™ Scotch-Weld™ Structural Adhesive Film AF 31/3M™ Scotch-Weld™ Structural
Adhesive Primer EC-2174 on Aluminum and Titanium. The adhesive was cured as indicated below.
The primer was air dried 30 minutes plus force dried 30 minutes at 250°F (121°C).
Product Performance
(continued)
Note: The following technical information and data should be considered representative
or typical only and should not be used for specification purposes.
Exposure Time and
Cure
Overlap Shear Strength (psi)
Temperature
Cycle
75°F (24°C)
300°F (149°C)
400°F (204°C)
2024 T-3 Alclad Aluminum
Control
A
3800
1960
500 hours at 300°F (149°C)
A
3410
2180
1000 hours at 300°F (149°C)
A
2980
2070
2000 hours at 300°F (149°C)
A
3240
2150
3000 hours at 300°F (149°C)
A
3170
2190
Control
B
4150
1710
192 hours at 400°F (204°C)
B
3850
1730
Control
C
3390
1240
192 hours at 400°F (204°C)
C
2790
1420
6,4 Titanium Alloy
Control
B
880
880
192 hours at 400°F (204°C)
B
640
820
Control
C
1490
630
192 hours at 400°F (204°C)
C
1310
1030
Cure Cycle A – 350°F (177°C), 45 minutes, 100 psi, 10°F/minute rise rate.
Cure Cycle B – 350°F (177°C), 120 minutes, 100 psi, 10°F/minute rise rate.
Cure Cycle C – Cure Cycle B plus post cured 120 minutes at 500°F (260°C).
7. Long Term Aging at 500°F (260°C) on Stainless Steel using a 350°F (177°C) cure for 120 minutes, 100 psi,
10°F rise rate/min.
Effect of 500°F (260°C) Aging on Overlap
Shear Strength of Scotch-Weld AF-31 / Scotch-Weld EC-2174



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