IMXRT1024IEC datasheet(1/90 Pages) NXP

Part #	IMXRT1024IEC

Description	i.MX RT1024 Crossover Processors Data Sheet for Industrial Products

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Manufacturer	NXP [NXP Semiconductors]

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NXP Semiconductors

Data Sheet: Technical Data

Document Number: IMXRT1024IEC

Rev. 0, 11/2020

MIMXRT1024CAG4A

Package Information

Plastic Package

144-Pin LQFP, 20 x 20 mm, 0.5 mm pitch

Ordering Information

See Table 2 on page 6

NXP reserves the right to change the production detail specifications as may be required

to permit improvements in the design of its products.

1

i.MX RT1024 introduction

The i.MX RT1024 is a processor of i.MX RT family

featuring NXP’s advanced implementation of the Arm®

Cortex®-M7 core, which operates at speeds up to 396

MHz to provide high CPU performance and real-time

response.

The i.MX RT1024 processor has 4 MB on-chip flash.

256 KB on-chip RAM can be flexibly configured as

TCM or general-purpose on-chip RAM. The i.MX

RT1024 integrates advanced power management module

with DCDC and LDO that reduces complexity of

external power supply and simplifies power sequencing.

The i.MX RT1024 also provides various memory

interfaces, including SDRAM, RAW NAND FLASH,

NOR FLASH, SD/eMMC, Quad SPI, and a wide range

of connectivity interfaces including UART, SPI, I2C,

USB, and CAN; for connecting peripherals including

WLAN, Bluetooth™, and GPS. The i.MX RT1024 also

has rich audio features, including SPDIF and I2S audio

interface. Various analog IP integration, including ADC,

analog comparator, temperature sensor, etc.

i.MX RT1024 Crossover

Processors Data Sheet

for Industrial Products

1. i.MX RT1024 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6

1.3. Package marking information . . . . . . . . . . . . . . . . 8

2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3.1. Special signal considerations . . . . . . . . . . . . . . . 16

3.2. Recommended connections for unused analog

interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 18

4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 18

4.2. System power and clocks . . . . . . . . . . . . . . . . . . 23

4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 29

4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 35

4.5. External memory interface . . . . . . . . . . . . . . . . . 40

4.6. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

4.7. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

4.8. Communication interfaces . . . . . . . . . . . . . . . . . . 60

4.9. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

5. Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

6. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 75

6.1. Boot mode configuration pins . . . . . . . . . . . . . . . 75

6.2. Boot device interface allocation . . . . . . . . . . . . . . 75

7. Package information and contact assignments . . . . . . . 80

7.1. 20 x 20 mm package information . . . . . . . . . . . . 80

8. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

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