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AT45DB021E Datasheet(PDF) 52 Page - Dialog Semiconductor

Part # AT45DB021E
Description  2-Mbit DataFlash (with Extra 64 kbits) 1.65 V Minimum SPI Serial Flash Memory
PDF  74 Pages
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Manufacturer  DIALOG [Dialog Semiconductor]
Direct Link  http://www.dialog-semiconductor.com/
Logo DIALOG - Dialog Semiconductor

AT45DB021E Datasheet(HTML) 52 Page - Dialog Semiconductor

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AT45DB021E
DS-AT45DB021E—8789J—03/2021
19.4 AC Characteristics
Note:
1. Values are based on device characterization, not 100% tested in production.
Symbol
Parameter
1.65 V to 3.6 V
2.3 V to 3.6 V
Units
Min
Typ
Max
Min
Typ
Max
fSCK
SCK Frequency
70
70
MHz
fCAR1
SCK Frequency for Continuous Read
70
85
MHz
fCAR2
SCK Frequency for Continuous Read
(Low Frequency)
33
33
MHz
fCAR3
SCK Frequency for Continuous Read
(Low Power Mode – 01h Opcode)
15
15
MHz
tWH
SCK High Time
4
4
ns
tWL
SCK Low Time
4
4
ns
tSCKR
(1)
SCK Rise Time, Peak-to-peak
0.1
0.1
V/ns
tSCKF(1)
SCK Fall Time, Peak-to-peak
0.1
0.1
V/ns
tCS
Minimum CS High Time
20
20
ns
tCSS
CS Setup Time
6
5
ns
tCSH
CS Hold Time
5
5
ns
tSU
Data In Setup Time
2
2
ns
tH
Data In Hold Time
1
1
ns
tHO
Output Hold Time
0
0
ns
tDIS(1)
Output Disable Time
8
6
ns
tV
Output Valid
7
6
ns
tWPE
WP Low to Protection Enabled
1
1
µs
tWPD
WP High to Protection Disabled
1
1
µs
tLOCK
Freeze Sector Lockdown Time
(from CS High)
200
200
µs
tEUDPD
(1)
CS High to Ultra-Deep Power-Down
3
3
µs
tCSLU
Minimum CS Low Time to Exit Ultra-Deep
Power-Down
20
20
ns
tXUDPD
Exit Ultra-Deep Power-Down Time
240
120
µs
tEDPD(1)
CS High to Deep Power-Down
2
2
µs
tRDPD
Resume from Deep Power-Down Time
35
35
µs
tXFR
Page to Buffer Transfer Time
100
100
µs
tCOMP
Page to Buffer Compare Time
100
100
µs
tRST
RESET Pulse Width
10
10
µs
tREC
RESET Recovery Time
1
1
µs
tSWRST
Software Reset Time
35
35
µs



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