7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

Input voltage

–0.3

6

V

EN

–0.3

Temperature

Operating

–55

150

°C

150

–65

170

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002 (1)

±2500

V

Charged-device model (CDM), per AEC Q100-011

±1500

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

5.5

V

(1)

See Figure 7-27 in Section 7.6 for minimum input voltage at different load currents and temperature

7.4 Thermal Information

THERMAL METRIC (1)

REF20xx-Q1

UNIT

DDC (SOT23)

5 PINS

Junction-to-ambient thermal resistance

193.6

°C/W

Junction-to-case (top) thermal resistance

40.2

°C/W

Junction-to-board thermal resistance

34.5

°C/W

Junction-to-top characterization parameter

0.9

°C/W

Junction-to-board characterization parameter

34.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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REF20-Q1

SBOSA80 – DECEMBER 2021

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