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STM32L071KB Datasheet(PDF) 122 Page - STMicroelectronics |
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STM32L071KB Datasheet(HTML) 122 Page - STMicroelectronics |
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122 / 148 page  Package information STM32L071xx 122/148 DS10690 Rev 7 Figure 48. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array package recommended footprint ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 80. UFBGA64 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 79. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A019_FP_V2 Dpad Dsm |
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