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STM32L071KB Datasheet(PDF) 124 Page - STMicroelectronics |
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STM32L071KB Datasheet(HTML) 124 Page - STMicroelectronics |
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124 / 148 page ![]() Package information STM32L071xx 124/148 DS10690 Rev 7 Figure 50. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball ,grid array recommended footprint ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 82. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA) Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 1.125 mm Pad trace width 0.100 mm Table 81. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch thin profile fine pitch ball grid array package outline (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max R8_FP_V1 Dpad Dsm |
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