STM32WB55 datasheet(189/193 Pages) STMICROELECTRONICS

189 / 193 page

DS11929 Rev 11

189/193

STM32WB55xx STM32WB35xx

Revision history

192

08-Oct-2018

(cont’d)

Updated Figure 2: STM32WB55xx RF front-end block diagram,

Figure 14: Power supply scheme (all packages except UFBGA129),

Figure 18: Typical energy detection (T = 27°C, VDD = 3.3 V) and

Figure 25: I/O input characteristics.

Added Figure 5: Power-up/down sequence, Figure 17: Typical link quality

indicator code vs. Rx level and Figure 18: Typical energy detection (T =

27°C, VDD = 3.3 V).

Added Table 24: RF transmitter BLE characteristics (1 Mbps), Table 25:

RF transmitter BLE characteristics (2 Mbps), Table 27: RF receiver BLE

characteristics (2 Mbps), Table 52: HSE crystal requirements and

Table 89: Minimum I2CCLK frequency in all I2C modes.

Added Device marking for UFQFPN48.

Removed former Figure 22: I/O AC characteristics definition(1) and

Figure 27: SMPS efficiency - VDDSMPS = 3.6 V.

20-Feb-2019

Updated document title.

Product status moved to Production data.

Introduced BGA129 package, hence updated image on cover page,

Table 16: STM32WB55xx pin and ball definitions and Section 8: Ordering

information, and added Figure 11: STM32WB55Vx UFBGA129 ballout(1)

and Section 7.1: UFBGA129 package information.

Updated Features, Section 3.3.4: Embedded SRAM, Section 3.17: Touch

sensing controller (TSC) and Section 3.24: Low-power universal

asynchronous receiver transmitter (LPUART).

Added Section 6.3.28: Clock recovery system (CRS).

Added Table 76: ADC sampling time.

Removed former Table 75: Maximum ADC RAIN and Table 84: SMPS

step-down converter characteristics.

Updated captions of figures 8, 9 and 10.

Updated Figure 43: VFQFPN68 recommended footprint.

Table 107. Document revision history (continued)

Date

Revision

Changes

STM32WB55 Datasheet(PDF) 189 Page - STMicroelectronics