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LM5145 Datasheet(PDF) 62 Page - Texas Instruments |
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LM5145 Datasheet(HTML) 62 Page - Texas Instruments |
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62 / 69 page ![]() www.ti.com PACKAGE OUTLINE C A 6.1 5.9 B 6.1 5.9 SEE TERMINAL DETAIL 3.3 0.1 40X 0.5 0.3 1 MAX (0.2) TYP 0.05 0.00 36X 0.5 2X 4.5 2X 4.5 40X 0.3 0.2 0.3 0.2 0.5 0.3 VQFN - 1 mm max height RHA0040P PLASTIC QUAD FLATPACK - NO LEAD 4226761/A 04/2021 PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 10 21 30 11 20 40 31 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD 41 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 2.200 DETAIL OPTIONAL TERMINAL TYPICAL LM25143 SNVSC10 – MARCH 2022 www.ti.com 62 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: LM25143 |
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