TMUX7348F datasheet(6/59 Pages) TI

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

VDD to VSS

Supply voltage

VDD to GND

–0.3

VSS to GND

–48

0.3

VFP to GND

Positive fault clamping voltage

–0.3

VDD + 0.3

VFN to GND

Negative fault clamping voltage

VSS – 0.3

0.3

VS to GND

Source input pin (Sx) voltage to GND

–65

VS to VDD

Source input pin (Sx) voltage to VDD

–90

VS to VSS

Source input pin (Sx) voltage to VSS

Drain pin (D or Dx) voltage

VFN–0.7

VFP+0.7

VEN or VAx

Logic control input pin voltage (EN, A0, A1, A2)(2)

GND –0.7

VxF

Logic output pin (SF, FF) voltage(2)

GND –0.7

IEN or IAx

Logic control input pin current (EN, A0, A1, A2)(2)

–30

IxF

Logic output pin (SF, FF) current(2)

–10

IS or ID (CONT)

Source or drain continuous current (Sx or D)

IDC ± 10 %(3)

Tstg

Storage temperature

–65

150

°C

Ambient temperature

–55

150

°C

Junction temperature

150

°C

Ptot (4)

Total power dissipation (QFN)

1900

Ptot (5)

Total power dissipation (TSSOP)

800

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not

sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality,

performance, and shorten the device lifetime.

(2)

Stresses have to be kept at or below both voltage and current ratings at all time.

(3)

Refer to Recommended Operating Conditions for IDC ratings.

(4)

For QFN package: Ptot derates linearly above TA = 70°C by 28.5 mW/°C

(5)

For TSSOP package: Ptot derates linearly above TA = 70°C by 12.0 mW/°C

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±3500

Charged device model (CDM), per JEDEC specification JESD22-

C101 or ANSI/ESDA/JEDEC JS-002(2)

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible if necessary precautions are taken.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible if necessary precautions are taken.

TMUX7348F

SCDS400 – MARCH 2022

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