TMUX7348F datasheet(7/59 Pages) TI

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7.3 Thermal Information

THERMAL METRIC(1)

TMUX7348F/ TMUX7349F

UNIT

PW (TSSOP)

RTJ (WQFN)

20 PINS

RθJA

Junction-to-ambient thermal resistance

84.3

35.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

22.7

28.3

°C/W

RθJB

Junction-to-board thermal resistance

37.3

13.5

°C/W

ΨJT

Junction-to-top characterization parameter

1.0

0.3

°C/W

ΨJB

Junction-to-board characterization parameter

36.7

13.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

4.1

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX UNIT

VDD – VSS (1)

Power supply voltage differential

VDD

Positive power supply voltage

VFP

Positive fault clamping voltage

VDD

VFN

Negative fault clamping voltage

VSS

Source pin (Sx) voltage (non-fault condition)

VFN

VFP

VS to GND

Source pin (Sx) voltage (fault condition)

–60

VS to VDD (2)

Source pin (Sx) voltage to VDD or VD (fault condition)

Source pin (Sx) voltage

to VDD or VD (fault

condition)

–85

VS to VSS (2)

Source pin (Sx) voltage to VSS or VD (fault condition)

Source pin (Sx) voltage

to VSS or VD (fault

condition)

Drain pin (D, Dx) voltage

VFN

VFP

VEN or VAx

Logic control input pin voltage (EN, A0, A1, A2)

VxF

Logic output pin (SF, FF) voltage

5.5

Ambient temperature

–40

125

°C

IDC (3)

Continuous current through switch

TA = 25°C

TA = 85°C

6.5

TA = 125°C

(1)

VDD and VSS can be any value as long as 8 V ≤ (VDD – VSS) ≤ 44 V.

(2)

Under a fault condition, the potential difference between source pin (Sx) and supply pins (VDD and VSS.) or source pin (Sx) and drain

pins (D, Dx) may not exceed 85 V.

(3)

Fault supplies are tied to the primary supplies (VFP= VDD, VFN = VSS)

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TMUX7348F

SCDS400 – MARCH 2022

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