AM6421 datasheet(7/235 Pages) TI

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4 Revision History

Changes from August 6, 2021 to February 16, 2022 (from Revision B (AUGUST 2021) to

Revision C (FEBRUARY 2022))

Page

• (Features): Removed On-the-Fly authentication support from OSPI..................................................................1

• (Device Comparison): Clarified speed grade options for each device. Also clarified functional safety support

and added a note that references the Nomenclature Description table..............................................................8

• (Pin Connectivity Requirements [was "Connections for Unused Pins"]): Added new pin connection

requirements and updated SERDES power pin connection requirements to include a condition of device

boundary scan usage....................................................................................................................................... 92

• (Absolute Maximum Ratings): Replaced free-air in the table description with junction and moved MCU_PORz

from a row of dual-voltage fail-safe pins to its own row.................................................................................... 96

• (Recommended Operating Conditions): Replaced free-air in the table description with junction and added a

note to VDD_MMC0 and VDD_DLL_MMC0.....................................................................................................99

• (Recommended Operating Conditions): Combined VDDS_DDR and VDDS_DDR_C into a single row and

added a note that explains these two power rails should be powered from the same source..........................99

• (Speed Grade Maximum Frequency): Updated Note 1 to reference the AM64x\AM243x DDR Board Design

and Layout Guidelines.................................................................................................................................... 100

• (LVCMOS Electrical Characteristics): Corrected the VOH MIN value for 1.8V Mode...................................... 103

• (Recommended Operating Conditions for OTP eFuse Programming): Replaced free-air in the table

description with junction and changed operating temperature description to remove ambient and replace with

junction. Also removed the recommendation for using a specific power management solution.....................106

• (ALV Package Thermal Resistance Characteristics): Updated TBD values in the table with actual values...107

• (Power-Up Sequencing): Updated Note 10 to clarify VDD_CORE and VDDR_CORE dependencies........... 110

• (Power-Down Sequencing): Added Note 5 to clarify VDD_CORE and VDDR_CORE dependencies............112

• (System Timing): Removed the maximum input slew rate requirement from the Systems Timing Conditions

table................................................................................................................................................................ 113

• (Clock Timing): Added MCU_EXT_REFCLK0 to the Clock Timing Requirements, and added

MCU_SYSCLKOUT0 and MCU_OBSCLK0 to the Clock Switching Characteristics...................................... 117

• (MCU_OSC0 Internal Oscillator Clock Source): Added a note to define the maximum ESRxtal value based on

the Cshunt parameter....................................................................................................................................... 120

• (DDRSS Switching Characteristics): Added a note that clarifies the min cycle time definition and references

the AM64x\AM243x DDR Board Design and Layout Guidelines.................................................................... 132

• (GPMC and NOR Flash — Synchronous Mode): Added a note to Timing Requirements and Switching

Characteristics tables to clarify maximum frequency relationship to data bus width...................................... 139

• (System Power Supply Monitor Design Guidelines): Updated maximum and minumum threshold values to

remove a few mV of rounding error in example provided............................................................................... 222

• (Standard Package Symbolization): Updated package symbolization figure................................................. 225

• (Tools and Software): Updated the supported development tools.................................................................. 226

• (Documentation Support) Updated/Changed the titles and URLs of Technical Reference Manual and Silicon

Errata references............................................................................................................................................ 227

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AM6442, AM6441, AM6421, AM6412, AM6411

SPRSP56C – JANUARY 2021 – REVISED FEBRUARY 2022

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