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AM2432BSDFHIALVR Datasheet(PDF) 112 Page - Texas Instruments |
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AM2432BSDFHIALVR Datasheet(HTML) 112 Page - Texas Instruments |
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112 / 242 page  7.9 Thermal Resistance Characteristics This section provides the thermal resistance characteristics used on this device. For reliability and operability concerns, the maximum junction temperature of the device has to be at or below the TJ value identified in Recommended Operating Conditions. 7.9.1 Thermal Resistance Characteristics Table 7-2. ALV Package Thermal Resistance Characteristics It is recommended to perform thermal simulations at the system level with the worst case device power consumption. NO. PARAMETER DESCRIPTION °C/W(1) (3) AIR FLOW (m/s)(2) ALV Package T1 RΘJC Junction-to-case 0.98 N/A T2 RΘJB Junction-to-board 3.87 N/A T3 RΘJA Junction-to-free air 12.8 0 T4 RΘJA Junction-to-moving air 9.2 1 T5 8.2 2 T6 7.6 3 T7 ΨJT Junction-to-package top 0.53 0 T8 0.55 1 T9 0.57 2 T10 0.58 3 T11 ΨJB Junction-to-board 3.74 0 T12 3.5 1 T13 3.4 2 T14 3.3 3 Table 7-3. ALX Package Thermal Resistance Characteristics It is recommended to perform thermal simulations at the system level with the worst case device power consumption. NO. PARAMETER DESCRIPTION °C/W(1) (3) AIR FLOW (m/s)(2) ALX Package T1 RΘJC Junction-to-case 4.8 N/A T2 RΘJB Junction-to-board 5.4 N/A T3 RΘJA Junction-to-free air 19.8 0 T4 RΘJA Junction-to-moving air 14.1 1 T5 13 2 T6 12.3 3 T7 ΨJT Junction-to-package top 0.06 0 T8 0.16 1 T9 0.21 2 T10 0.25 3 T11 ΨJB Junction-to-board 5.3 0 T12 4.95 1 T13 4.88 2 T14 4.83 3 (1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: AM2434, AM2432, AM2431 SPRSP65C – APRIL 2021 – REVISED MARCH 2022 www.ti.com 112 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated Product Folder Links: AM2434 AM2432 AM2431 |
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