FXLS8964AF datasheet(88/98 Pages) NXP

88 / 98 page

NXP Semiconductors

FXLS8964AF

3-Axis Low-g Accelerometer

19 Mounting information

19.1 PCB mounting recommendations

• No additional via, copper layer, solder mask, metal pattern underneath package on the

mounted layer of the PCB.

• Do not place any components or vias within 2 mm of the package land area as it may

cause additional package stress if placed too close to the package land area.

• Signal traces connected to pads should be as symmetric as possible. To have the

same length of exposed trace for all pads, put dummy traces on NC pads .

• Use a standard pick-and-place process and equipment. Do not use a hand soldering

process.

• Customers are advised to be cautious about the proximity of screw-down holes to the

sensor, and the location of any press fit to the assembled PCB when in an enclosure.

It is important that the assembled PCB remain flat after assembly to keep electronic

operation of the device optimal.

• The PCB should be rated for the multiple lead-free reflow condition with a maximum

260 °C temperature.

• NXP sensors are compliant with Restrictions on Hazardous Substances (RoHS),

having halide-free molding compound (green) and lead-free terminations. These

terminations are compatible with tin-lead (Sn-Pb) as well as tin-silver-copper (Sn-Ag-

Cu) solder paste soldering processes. Reflow profiles applicable to those processes

can be used successfully for soldering the devices.

FXLS8964AF

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 3.4 — 7 December 2021

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FXLS8964AF Datasheet(PDF) 88 Page - NXP Semiconductors