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TC35679FSG Datasheet(PDF) 11 Page - Toshiba Semiconductor

Part # TC35679FSG
Description  TC35679FSG-002 Bluetooth® low energy IC
PDF  45 Pages
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

TC35679FSG Datasheet(HTML) 11 Page - Toshiba Semiconductor

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TC35679FSG-002
2018-01-17
11
2.4. Power Supply Pins
Table 2-4 shows the attributes and descriptions of power supply pins for normal operations.
Table 2-4 Power supply pins
Pin name
Pin
number
Attribute
Description
Type
VDD/GND
VDD / GND
VPGM
5
TEST
—
Test pin
Please connect VPGM to GND.
VBAT
18
VBAT
VDD
Power supply pin for DCDC and sleep circuit.
Connect the external power source for DCDC and LDO built
into the IC.
LX
19
VBAT
VDD
DCDC output pin.
Please connect to external inductor for DCDC.
VDDCORE1
14
—
VDD
DCDC for feedback input, analog circuit power supply pin.
Please connect to external inductor for DCDC.
VDDCORE2
15
—
VDD
DCDC for feedback input, digital circuit power supply pin.
Please connect to external inductor for DCDC.
VDDIO1
VDDIO2
1
23
VDDIO
VDD
IO power supply.
Power supply pin for GPIO.
VSSA
8
Analog
GND
GND pin for analog, this pin needs to be connected to GND.
VSSRFIO
6
Analog
GND
GND pin for RFIO, this pin needs to be connected to GND.
VSSX
13
Analog
GND
GND pin for OSC, this pin needs to be connected to GND.
VSSDC
20
Digital
GND
GND pin for DCDC, this pin needs to be connected to GND.
VSSD1
VSSD2
27
FIN
Analog, Digital
GND
GND pin for analog, digital common, this pin needs to be
connected to GND.
Connect the exposed Die Pad to GND because this pad is
digital ground as well.



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