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© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard

F3122_R46_X2_310_125C • 10/31/2022

Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com

Metallized Polypropylene Film EMI Suppression Capacitors

R46, Class X2, 310 VAC, 125°C

Lead Taping & Packaging (IEC 60286–2)

Taping Specification

Description

Symbol

Dimensions (mm)

Lead Space

Tol.

10

15

22.5

27.5

Fig. 1

Fig. 2

Fig. 3

Fig. 3

Lead wire diameter

d

0.6

0.6–0.8

0.8

0.8

±0.05

Taping lead space

P

25.4

25.4

38.1

38.1

±1

Feed hole lead space *

P

0

12.7

12.7

12.7

12.7

±0.2 **

Centering of the lead wire

P

1

7.7

5.2

7.8

5.3

±0.7

Centering of the body

P

2

12.7

12.7

19.05

19.05

±1.3

Lead spacing (pitch) ***

F

10

15

22.5

27.5

+0.6/−0.1

Component alignment

∆h

0

0

0

0

±2

Height of component

from tape center

H0 ****

18.5

18.5

18.5

18.5

±0.5

Carrier tape width

W

18

18

18

18

+1/−0.5

Hold down tape width

W

0

9

10

10

10

Minimum

Hole position

W

1

9

9

9

9

±0.5

Hold down tape position

W

2

3

3

3

3

Maximum

Feed hole diameter

D

0

4

4

4

4

±0.2

Total tape thickness

t

0.7

0.7

0.7

0.7

±0.2

* 15 mm also available

** Maximum of 1 mm on 20 lead spaces

*** Pitches 15 mm and 10 mm taped to 7.5 mm (crimped leads) available upon request

**** H

0 = 16.5 mm is available upon request

P

P2

P0

F

h

P1

D0

h

ød

P

P2

P1

Figure 1

Lead Spacing 10 mm

Figure 2

Lead Spacing 15 mm

Figure 3

Lead Spacing 22.5 – 27.5 mm

t

A-B

A

B