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STM32C011F6U6 Datasheet(PDF) 85 Page - STMicroelectronics |
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STM32C011F6U6 Datasheet(HTML) 85 Page - STMicroelectronics |
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85 / 94 page ![]() DS13866 Rev 3 85/94 STM32C011x4/x6 Package information 90 Figure 31. WLCSP12 – Footprint example Device marking The following figure gives an example of topside marking orientation versus pin 1 identifier location. The printed markings may differ depending on the supply chain. Other optional marking or inset/upset marks that identify the parts throughout supply chain operations, are not indicated below. Figure 32. WLCSP12 package marking example Table 66. WLCSP12 – Example of PCB design rules Dimension Recommended values Pitch 0.35 mm Dpad 0.200 mm Dsm 0.275 mm Stencil thickness 0.08 mm BGA_WLCSP_FT_V1 Dsm Dpad MS55865V1 Date code Pin 1 identifier 3C0 Product identification(1) Y WW |
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