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MPC603EC/D Datasheet(PDF) 20 Page - NXP Semiconductors |
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MPC603EC/D Datasheet(HTML) 20 Page - NXP Semiconductors |
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20 / 31 page ![]() 20 603 Hardware Specifications 1.7.2.2 Mechanical Dimensions of the IBM C4-CQFP Package Figure 11 shows the mechanical dimensions for the IBM C4-CQFP package. Figure 11. Mechanical Dimensions of the IBM C4-CQFP Package *Reduced pin count shown for clarity. 60 pins per side min max A 31.8 32.2 B 34.4 34.8 C 2.33 2.93 D 0.45 0.55 E 0.18 0.28 F 0.585 0.685 G 0.12 0.20 H 0.40 0.60 Jmin 0.30 0.40 Ang 0.0 ° 5.0 ° Rad — 0.25 Clip Leadframe Chip Tape Cast Ceramic Epoxy Dam Urethane Solder-Bump Encapsulant H Jmin Radius 0.08 F G A B E 0.13 TOTAL s A-B -C- 0.13 TOTAL s A-B 0.08 TOTAL M A-B D -A- Pin 240 Pin 1 * Not to scale All measurements in mm Ang -B- C AR CH IVE D B Y F RE ES CA LE SE MI CO ND UC TO R, INC . |
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