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MPC603EC/D Datasheet(PDF) 6 Page - NXP Semiconductors

Part # MPC603EC/D
Description  PowerPC 603™ RISC Microprocessor Hardware Specifications
PDF  31 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

MPC603EC/D Datasheet(HTML) 6 Page - NXP Semiconductors

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6
603 Hardware Specifications
Table 5 provides the power consumption for the 603.
Output low voltage, IOL = 14 mA
VOL
—
0.4
V
Capacitance, Vin = 0 V, f = 1 MHz (excludes TS, ABB, DBB, and ARTRY)Cin
—
10.0
pF
2
Capacitance, Vin = 0 V, f = 1 MHz (for TS, ABB, DBB, and ARTRY)Cin
—
15.0
pF
2
Notes:
1. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK), and JTAG signals.
2. Capacitance is periodically sampled rather than 100% tested.
Table 5. Power Consumption
Vdd = 3.3
± 5% V dc, GND = 0 V dc, 0 ≤ T
j ≤ 105 °C
CPU Clock:
SYSCLK
Processor Core Frequency
Unit
66.67 MHz
80 MHz
Full-On Mode
Typical
Maximum
1.8
2.0
W
2.5
2.9
W
Doze Mode*
Typical
740
800
mW
Nap Mode*
Typical
160
160
mW
Sleep Mode*
Typical
125
130
mW
Sleep Mode—PLL Disabled*
Typical
70
40
mW
Sleep Mode—PLL and SYSCLK Disabled*
Typical
2
2
mW
Note: These values apply for all valid PLL_CFG[0–3] settings and do not include
output driver power (OVdd) or analog supply power (AVdd). OVdd power is
system dependent but is typically
≤ 10% of Vdd. Worst-case AVdd = 15 mW.
Table 4. DC Electrical Specifications (Continued)
Vdd = 3.3
± 5% V dc, GND = 0 V dc, 0 ≤ T
j ≤ 105 °C
Characteristic
Symbol
Min
Max
Unit
Notes
AR
CH
IVE
D B
Y F
RE
ES
CA
LE
SE
MI
CO
ND
UC
TO
R,
INC
.



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