| Electronic Components Datasheet Search |
|
MIC2593 Datasheet(PDF) 24 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
MIC2593 Datasheet(HTML) 24 Page - STMicroelectronics |
|
24 / 26 page ![]() MIC2593 Micrel M9999-042204 24 April 2004 MOSFET Vendors Key MOSFET Type(s) Web Address Vishay (Siliconix) Si4430DY (“LITTLE FOOT® ” Series) www.siliconix.com Si4420DY (“LITTLE FOOT® ” Series) International Rectifier IRF7413A (SO-8 package part) www.irf.com Si4420DY (second source to Vishay) Fairchild Semiconductor FDS6644 (SO-8 package part) www.fairchildsemi.com FDS6670A (SO-8 package part) FDS6688 (SO-8 package part) Resistor Vendors Sense Resistors Web Address Vishay (Dale) WSL Series WSL 3637 Series www.vishay.com/docs/wsl_30100.pdf IRC OARS Series irctt.com/pdf_files/OARS.pdf LR Series irctt.com/pdf_files/LRC.pdf (second source to WSL) Table 5. Power MOSFET and Resistor Values MOSFET and Sense Resistor Selection Guide Listed in Table 5 below, by Manufacturer and Type Number, are some of the more popular MOSFET and resistor types used in PCI hot plug applications. Although far from compre- hensive, this information will constitute a good starting point for most designs. Power Supply Decoupling In general, prudent system design requires that power sup- plies used for logic functions should have less than 100mV of noise at frequencies of 100kHz and above. In particular, the –12V supply should have less than 100mV of peak-to-peak noise at frequencies of 1MHz or higher. This is because the –12V supply is the most negative potential applied to the IC, and is therefore connected to the device's substrate. All of the subcircuits integrated onto the silicon chip are hence sub- jected by capacitive coupling to any HF noise on the –12V supply. While individual capacitances are quite low, the amount of injected energy required to cause a "glitch" can also be quite low at the internal nodes of high speed logic circuits. Less obviously, but equally important, is the fact that the internal charge pump for the 3.3V AUX supplies is somewhat susceptible to noise on the +12V input when that input is at or near zero volts. The +12V supply should not carry HF noise in excess of 200mV peak-to-peak with respect to chip ground when it is in the "off" state. If either the –12V input, the +12V input, of both supplies do carry significant HF noise (as can happen when they are locally derived by a switching converter), the solution is both small and inexpensive. An LC filter made of a ferrite bead between the noisy power supply input and the MIC2593, followed by a "composite capacitor" from the affected MIC2593 input pin to ground, will suffice for almost any situation. A good composite capacitor for this purpose is the parallel combination of a 47 µF tantalum bulk decoupling capacitor, and one 1 µF and one 0.01µF ceramic capacitor for high- frequency bypass. A suggested ferrite bead for such use is Fair-Rite Products Corporation part number 2743019447 (this is a surface-mountable part). Similar parts from other vendors or a 0.27 µH air-core coil can also be used. Noisy VIN To MIC2593 SMT Ferrite Bead Fair-Rite Products Type 2743019447 47 µF Tanalum 1 µF Ceramic 10nF Ceramic Figure 14. Filter Circuit for Noisy Supplies (+3.3V and/or –12V) It is theoretically possible that high-amplitude, HF noise reflected back into one or both of the MIC2593’s –12V outputs could interfere with proper device operation, although such noisy loads are unlikely to occur in the real world. If this becomes an application-specific concern, a pair of filters similar to that in Figure 14 will provide the required HF bypassing. The capacitors would be connected to the MIC2593’s –12V output pins, and the ferrite beads would be placed between the –12V output pins and the loads. –12V Input Clamp Diode The –12V input to the MIC2593 is the most negative potential on the part and is therefore connected to the chip’s substrate (as described in “Power Supply Decoupling,” above). Al- though no particular sequencing of the –12V supply relative to the other MIC2593 supplies is required for normal opera- tion, this substrate connection does mean that the –12V input must never exceed the voltage on the GROUND pin of the IC by more than 0.3 volts. Small amounts of internal leakage current can cause this to happen when the VSTBY pins are energized and the 12MVIN pins are not energized. In addition, power supply output ringing or L(di/dt) effects in the wiring and on the PCB itself will cause brief transient voltages in excess of +0.3V to appear at the –12V input. For this reason, it is required to clamp the –12V input to ground with a Schottky diode. A diode rated at 1 amp and 20V to 40V as shown in our application schematic diagram is suggested. The diode’s anode should be physically placed directly at the –12V input to the MIC2593, and its cathode should have as short a path as possible back to the part’s ground. A good SMT part for this application is a type MBRS140T3 (1A, 40V). |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |