LTM4686 datasheet(4/132 Pages) AD

4 / 132 page

LTM4683

Rev. 0

For more information www.analog.com

PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

Terminal Voltages

VINnn (Note 4), SVIN_nn, IIN_nn+, IIN_nn−,

VIN_VBIAS, RUNP ........................................ –0.3V to 16V

(SVIN_nn – IIN_nn+), (IIN_nn+ – IIN_nn−) ....... –0.3V to 0.3V

SWn ............................ −1V to 16V, −5V to 16V Transient

INTVCC_nn, VBIAS ......................................... –0.3V to 6V

VOUTn .........................................................–0.3V to 1.0V

VOSNSn+......................................................–0.3V to 1.0V

VOSNSn−..................................................... –0.3V to 0.3V

RUNn, SDA_nn, SCL_nn, ALERT_nn ......... –0.3V to 5.5V

FSWPH_nn_CFG, VOUTn_CFG,

VTRIMn_CFG, ASEL_nn.......................... –0.3V to 2.75V

FAULTn, SYNC_nn, SHARE_CLK_nn,

WP_nn, PGOODn ...................................... −0.3V to 3.6V

COMPna, COMPnb.................................... –0.3V to 2.7V

TSNSn....................................................... –0.3V to 0.8V

n = 0, 1, 2, 3 and nn = 01, 23

VDD33_nn and VDD25_nn are outputs not to be driven.

Temperatures

Internal Operating Temperature Range

(Notes 2, 13, 15, 16)............................... –40°C to 125°C

Storage Temperature Range .................. –55°C to 125°C

Peak Solder Reflow Package Body Temperature... 245°C

(Note 1)

9 10 11 12 13 14

VOUT0

GND

TOP VIEW

BGA PACKAGE

330-PIN (15mm × 22mm × 5.71mm)

TJMAX = 125°C, θJCtop = 2.8°C/W, θJCbottom = 1.4°C/W, θJA = 4.73°C/W

VOUT1

VOUT2

VOUT3

SW0

SW1

SW3

VIN23

VIN01

SW2

SHARE_CLK_01

VTRIM0_CFG

VDD25_01 VTRIM1_CFG

VIN_VBIAS

COMP1b

VDD33_01

VOSNS1–

COMP1a

VOSNS1+

VOSNS2+

INTVCC_01

SVIN_01

SCL_23

ALERT_23

RUN3

SYNC_23

SDA_23

PGOOD0

PGOOD1

COMP2b

COMP2a

RUNP

ALERT_01

SYNC_01

TSNS0

TSNS1

TSNS3

SVIN_23

INTVCC_23

COMP0b

COMP0a

IN_01+

VOSNS0–

IN_01–

IN_23–

VOSNS2–

TSNS2

IN_23+

VOSNS0+

PGOOD2

VOSNS3+

PGOOD3 VOSNS3

–

FAULT2

COMP3a

FAULT3

COMP3b

VDD33_23

WP_23

VBIAS

SGND_01

SGND_23

RUN2

SDA_01

SCL_01

WP_01

NOTES:

1) θ VALUES ARE DETERMINED BY SIMULATION PER JESD51 CONDITIONS, WEIGHT = 6.4g (TYP.).

2) θJA VALUE IS OBTAINED WITH DEMO BOARD.

3) SEE THERMAL CONSIDERATIONS AND OUTPUT CURRENTDERATING FOR LAB MEASUREMENT

AND DERATING INFORMATION.

ORDER INFORMATION

PART NUMBER

PAD OR BALL FINISH

PART MARKING

PACKAGE

TYPE

MSL

RATING

TEMPERATURE RANGE

(SEE NOTE 2)

DEVICE

FINISH CODE

LTM4683EY#PBF

SAC305 (RoHS)

LTM4683Y

BGA

–40°C to 125°C

LTM4683IY#PBF

SAC305 (RoHS)

LTM4683Y

BGA

–40°C to 125°C

• Contact the factory for parts specified with wider operating temperature

ranges. Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Recommended LGA and BGA PCB Assembly and Manufacturing

Procedures

• LGA and BGA Package and Tray Drawings

LTM4686 Datasheet(PDF) 4 Page - Analog Devices

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