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MSC8144 Datasheet(PDF) 32 Page - Freescale Semiconductor, Inc |
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MSC8144 Datasheet(HTML) 32 Page - Freescale Semiconductor, Inc |
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32 / 80 page ![]() MSC8144 Quad Core Digital Signal Processor Data Sheet, Rev. 1 Electrical Characteristics Freescale Semiconductor 32 2.6.3 PCI DC Electrical Characteristics The measurements in Table 13 assume the following system conditions: •TA = 25 °C • GND = 0 VDC Note: The leakage current is measured for nominal conditions. 2.6.4 TDM DC Electrical Characteristics The measurements in Table 14 assume the following system conditions: •TA = 25 °C • GND = 0 VDC Note: The leakage current is measured for nominal conditions. 2.6.5 UART DC Electrical Characteristics TBD Table 13. PCI DC Electrical Characteristics Characteristic Symbol Min Max Unit Supply voltage 3.3 V VDDPCI 3.135 3.465 V Input high voltage VIH 0.5 × VDDPCI 3.465 V Input low voltage VIL –0.5 0.3 × VDDPCI V Input Pull-up voltage2 VIPU 0.7 × VDDPCI Input leakage current, 0<VIN <VDDPCI IIN –10 10 μA Tri-state (high impedance off state) leakage current, 0<VIN <VDDPCI IOZ –10 10 μA Signal low input current, VIL = 0.4 V 2 IL –10 10 μA Signal high input current, VIH = 2.0 V 2 IH –10 10 μA Output high voltage, IOH = –0.5 μA, except open drain pins VOH 0.9 × VDDPCI —V Output low voltage, IOL= 1.5 μAVOL —0.1 × VDDPCI V Input Pin Capacitance CIN 10 pF Notes: 1. See Figure 6 for undershoot and overshoot voltages. 2. Not tested. Guaranteed by design. Table 14. TDM DC Electrical Characteristics Characteristic Symbol Min Max Unit Supply voltage 3.3 V VDDTDM 3.135 3.465 V Input high voltage VIH 2.0 3.465 V Input low voltage VIL –0.3 0.8 V Input leakage current, 0<VIN <VDDTDM IIN –10 10 μA Tri-state (high impedance off state) leakage current, IOZ –10 10 μA Signal input current,1 IL –10 10 μA Output high voltage, IOH = –1.6 mA, VOH 2.4 — V Output low voltage, IOL= 0.4mA VOL —0.4 V Pin Capacitance Cp 8 pF Note: Not tested. Guaranteed by design. |
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