33797 datasheet(5/34 Pages) FREESCALE

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Analog Integrated Circuit Device Data

Freescale Semiconductor

33797

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Rating

Symbol

Value

Unit

INPUT ELECTRICAL RATINGS

Voltage on VDD

VDD

7.0

Voltage on Input pins CS, CLK, D1, D0, FEN_1, FEN_2, RESETB,

R_DIAG, R_LIMIT_X

-0.3 to VDD + 0.3

Voltage on Squib pins SQB_HI_XX, SQB_LO_XX, SENSE_XX

VVFIRE_XX

-0.3 to VVFIRE + 0.3

Voltage on pins VDIAG_X, VFIRE_XX

VDIAG_X

-0.3 to 35

ESD Voltage (1)

Human Body Model

Machine Model

VESD1

VESD2

±2000

±200

Maximum VVFIRE with Pulsed Output

(2), (3)

RSQUIB = 2.0 Ω, tON = 0.8 ms, ISQUIB = 2.24 A

RSQUIB = 1.2 Ω, tON = 0.8 ms, ISQUIB = 2.24 A

RSQUIB = 0.1 Ω, tON = 0.60 ms, ISQUIB = 2.24 A

VFPULSE

THERMAL RATINGS

Storage Temperature

TSTG

155

°C

Junction Temperature Ambient

Continuous (Prior to Squib Deployment)

≤ 5.0 ms (Post-Squib Deployment)

TJCONT

TJDPYD

100

300

°C

Peak Package Reflow Temperature During Reflow (4), (5)

TPPRT

Note 5.

°C

Thermal Resistance (Junction-to-Ambient)

RθJ-A

°C/W

Notes

ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), ESD2 testing is performed in

accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω).

With a nominal squib load, the FET squib driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms.

The individual squib driver thermal shutdown will not affect other squib driver firing “ON” times. With a shorted squib load, the FET squib

driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms. When the thermal shutdown limit is

exceeded, the FET driver will turn OFF and the thermal status bit will be set to 1. The FET squib driver can be activated through the

arm/fire command when the TEMPRENABLE (MIN) is reached (thermal shutdown status “0”). Nominal squib load is 2.15 Ω ±0.15 Ω.

Shorted squib load is 0.1

Ω.

Three-squib driver with RSQUIB = 0.1 Ω conditions. Remaining squib driver conditions: RSQUIB = 1.2 Ω, tON = 4.0 ms, ISQUIB = 2.0 A,

VVDIAG_X = VVFIRE_XX = 35 V.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL),

Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.

MC33xxxD enter 33xxx), and review parametrics.

33797 Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc

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