Package mechanical

M58WRxxxKU, M58WRxxxKL

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Package mechanical

In order to meet environmental requirements, ST offers the M58WRxxxKU/L in ECOPACK®

packages. These packages have a Lead-free second-level interconnect. The category of

Second-Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 3.

VFBGA44 7.5 × 5 mm, 10 × 4 ball array, 0.50 mm pitch, bottom view

package outline

1.

Drawing is not to scale.

A2

A1

BGA-Z52

D

D1

FD

b

E

E1

ddd

SD

SE

FE

A

BALL "A1"

E2

D2

FD1

FE1

e