PACKAGE OUTLINE

DQN0004A

X2SON - 0.4 mm max height

PLASTIC SMALL OUTLINE - NO LEAD

4215302/E 12/2016

NOTES:

1.

All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2.

This drawing is subject to change without notice.

3.

The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

4.

Features may not exist. Recommend use of pin 1 marking on top of package for orientation purposes.

5.

Shape of exposed side leads may differ.

6.

Number and location of exposed tie bars may vary.

www.ti.com

B

A

SEATING PLANE

C

0.08

PIN 1

INDEX AREA

0.1

C A B

0.05

C

PIN 1 ID

(OPTIONAL)

NOTE 4

EXPOSED

THERMAL PAD

1

2

3

4

1

1.05

0.95

1.05

0.95

0.4 MAX

2X 0.65

0.48

+0.12

-0.1

3X

0.30

0.15

0.3

0.2

4X

0.28

0.15

0.05

0.00

(0.11)

NOTE 5

NOTE 6

NOTE 6

5

(0.07) TYP

(0.05) TYP