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TLV743P

SBVS310C – JULY 2017 – REVISED JUNE 2019

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Copyright © 2017–2019, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 4

6

Specifications......................................................... 5

6.1

Absolute Maximum Ratings ...................................... 5

6.2

ESD Ratings.............................................................. 5

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information .................................................. 5

6.5

Electrical Characteristics........................................... 6

6.6

Typical Characteristics .............................................. 8

7

Detailed Description ............................................ 13

7.1

Overview ................................................................. 13

7.2

Functional Block Diagram ....................................... 13

7.3

Feature Description................................................. 14

7.4

Device Functional Modes........................................ 15

8

Application and Implementation ........................ 16

8.1

Application Information............................................ 16

8.2

Typical Application .................................................. 18

9

Power Supply Recommendations ...................... 19

10

Layout................................................................... 19

10.1

Layout Guidelines ................................................. 19

10.2

Layout Examples................................................... 19

11

Device and Documentation Support ................. 20

11.1

Device Support .................................................... 20

11.2

Documentation Support ........................................ 20

11.3

Receiving Notification of Documentation Updates 20

11.4

Community Resources.......................................... 20

11.5

Trademarks ........................................................... 21

11.6

Electrostatic Discharge Caution ............................ 21

11.7

Glossary ................................................................ 21

12

Mechanical, Packaging, and Orderable

Information ........................................................... 21

4 Revision History

Changes from Revision B (March 2018) to Revision C

Page

•

Changed description of EN pin in Pin Functions table ........................................................................................................... 4

•

Deleted typical specification from VEN(HI) and VEN(LO) parameters ......................................................................................... 6

•

Added maximum specification to ILIM parameter ................................................................................................................... 7

•

Added condition to 1-V Load Regulation vs IOUT and Temperature figure ............................................................................. 8

•

Added condition to 1.8-V Load Regulation vs IOUT and Temperature figure .......................................................................... 8

•

Added condition to 3.3-V Load Regulation vs IOUT and Temperature figure ......................................................................... 8

•

Added condition to 1.2-V Dropout Voltage vs IOUT and Temperature figure ......................................................................... 9

•

Added condition to 1.8-V Dropout Voltage vs IOUT and Temperature figure ......................................................................... 9

•

Added condition to 3.3-V Dropout Voltage vs IOUT and Temperature figure ......................................................................... 9

•

Added and Output Enable to title and changed first paragraph of Shutdown and Output Enable section .......................... 14

•

Added DBV package to Maximum Ambient Temperature vs Device Power Dissipation figure and text reference............. 17

•

Added (3) to Device Nomenclature table ............................................................................................................................. 20

Changes from Revision A (January 2018) to Revision B

Page

•

Changed X2SON package from preview to production data (active) .................................................................................... 1

Changes from Original (July 2017) to Revision A

Page

•

Added X2SON package to Features list ................................................................................................................................ 1

•

Added DQN (X2SON) package to Description section ......................................................................................................... 1

•

Added X2SON package to Device Information table ............................................................................................................. 1

•

Added DQN (X2SON) package pinout drawing and pin functions table to Pin Configuration and Functions section .......... 4

•

Deleted thermal pad from DBV pinout drawing and Pin Functions table .............................................................................. 4

•

Changed format of I/O column contents and order of packages in Pin Functions table ....................................................... 4

•

Added DQN (X2SON) thermal information to Thermal Information table ............................................................................. 5

•

Changed condition text for Figure 31 .................................................................................................................................. 17