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TLV74333PDBVR Datasheet(PDF) 23 Page - Texas Instruments |
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TLV74333PDBVR Datasheet(HTML) 23 Page - Texas Instruments |
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23 / 39 page ![]() EXAMPLE BOARD LAYOUT DQN0004A X2SON - 0.4 mm max height PLASTIC SMALL OUTLINE - NO LEAD 4215302/D 06/2016 NOTES: (continued) 5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271) . 6. If any vias are implemented, it is recommended that vias under paste be filled, plugged or tented. 23 TLV743P www.ti.com SBVS310C – JULY 2017 – REVISED JUNE 2019 Product Folder Links: TLV743P Submit Documentation Feedback Copyright © 2017–2019, Texas Instruments Incorporated |
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