TDA4APE4 datasheet(2/272 Pages) TI

2 / 272 page

Ethernet:

• Two RGMII/RMII interfaces

Automotive interfaces:

• Twenty Modular Controller Area Network (MCAN)

modules with full CAN-FD support

Display subsystem:

• Two DSI 4L TX (up to 2.5k)

• One eDP/DP interface with Multi-Display Support

(MST)

• One DPI

Audio interfaces:

• Five Multichannel Audio Serial Port (MCASP)

modules

Video acceleration:

• H.264/H.265 Encode/Decode, up to 960MP/s

Flash memory interfaces:

• Embedded MultiMediaCard Interface ( eMMC™

5.1)

• One Secure Digital® 3.0 / Secure Digital Input

Output 3.0 interfaces (SD3.0/SDIO3.0

• Universal Flash Storage (UFS 2.1) interface with

two lanes

• Two independent flash interfaces configured as

– One OSPI or HyperBus™ or QSPI flash

interfaces, and

– One QSPI flash interface

System-on-Chip (SoC) architecture:

• 16-nm FinFET technology

• 27mm × 27mm, 0.8-mm pitch, 1063-pin FCBGA

(AND), enables IPC class 3 PCB routing

TPS6594-Q1 Companion Power Management

ICs (PMIC):

• Functional Safety support up to ASIL-D

• Flexible mapping to support different use cases

2 Applications

• Automotive:

• Advanced surround view and park assistance systems

• Autonomous sensor fusion / perception systems including camera, radar and LiDAR sensors

• Mono and multi-sensor Front camera systems

• Next generation eMirror systems

• Off-highway vehicle control

• ADAS Domain Controller

TDA4VPE-Q1, TDA4APE-Q1

SPRSPB4A – JUNE 2024 – REVISED DECEMBER 2024

www.ti.com

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Product Folder Links: TDA4VPE-Q1 TDA4APE-Q1

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