LPC2364 datasheet(35/47 Pages) NXP

35 / 47 page

LPC2364_66_68_2

Preliminary data sheet

Rev. 02 — 1 October 2007

35 of 47

NXP Semiconductors

LPC2364/66/68

Fast communication chip

IDD(DCDC)act(3V3) active mode DC-to-DC

converter supply

current (3.3 V)

VDD(DCDC)(3V3) = 3.3 V;

Tamb =25 °C; code

while(1){}

executed from ﬂash; no

peripherals enabled;

PCLK = CCLK

CCLK = 10 MHz

CCLK = 72 MHz

all peripherals enabled;

PCLK = CCLK / 8

CCLK = 10 MHz

CCLK = 72 MHz

all peripherals enabled;

PCLK = CCLK

CCLK = 10 MHz

CCLK = 72 MHz

125

IDD(DCDC)pd(3V3)

power-down mode

DC-to-DC converter

supply current (3.3 V)

VDD(DCDC)(3V3) = 3.3 V;

Tamb =25 °C

150

µA

IDD(DCDC)dpd(3V3) deep power-down

mode DC-to-DC

converter supply

current (3.3 V)

VDD(DCDC)(3V3) = 3.3 V;

Tamb =25 °C

-15

µA

IBATact

active mode battery

supply current

DC-to-DC converter on

[9] -20

µA

DC-to-DC converter off

[9] -28

µA

I2C-bus pins (P0[27] and P0[28])

VIH

HIGH-level input

voltage

0.7VDD(3V3) --V

VIL

LOW-level input voltage

0.3VDD(3V3) V

Vhys

hysteresis voltage

0.5VDD(3V3) -V

VOL

LOW-level output

voltage

IOLS = 3 mA

[6] -

0.4

ILI

input leakage current

VI =VDD(3V3)

[10] -2

µA

VI =5V

µA

Oscillator pins

Vi(XTAL1)

input voltage on pin

XTAL1

1.8

Vo(XTAL2)

output voltage on pin

XTAL2

1.8

Vi(RTCX1)

input voltage on pin

RTCX1

1.8

Vo(RTCX2)

output voltage on pin

RTCX2

1.8

Table 5.

Static characteristics …continued

Tamb = −40 °C to +85 °C for commercial applications, unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ[1]

Max

Unit

LPC2364 Datasheet(PDF) 35 Page - NXP Semiconductors

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