MSC8144EC datasheet(75/80 Pages) FREESCALE

75 / 80 page

Ordering Information

MSC8144EC Quad Core Digital Signal Processor Data Sheet, Rev. 6

Freescale Semiconductor

Ordering Information

Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.

Package Information

Part

Package Type

Spheres

Core

Voltage

Operating

Temperature

Core

Frequency

(MHz)

Order Number

MSC8144E

Flip Chip Plastic Ball Grid Array (FC-PBGA)

Lead-free

1.0 V

–40° to 105°C

800

TBD

0° to 90°C

1000

TBD

Figure 45. MSC8144EC Mechanical Information, 783-ball FC-PBGA Package

Notes:

1. All dimensions in millimeters.

2. Dimensioning and tolerancing

per ASME Y14.5M–1994.

3. Maximum solder ball diameter

measured parallel to Datum A.

4. Datum A, the seating plane, is

determined by the spherical

crowns of the solder balls.

5. Parallelism measurement

should exclude any effect of

marking.

6. Capacitors may not be present

on all devices.

7. Caution must be taken not to

short exposed metal capacitor

pads on package top.

CASE NO. 1842-02

MSC8144EC Datasheet(PDF) 75 Page - Freescale Semiconductor, Inc

MSC8144EC Datasheet(HTML) 75 Page - Freescale Semiconductor, Inc

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