LM48560

SNAS513F – AUGUST 2011 – REVISED NOVEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD

Supply voltage(2)

6

V

SW

Voltage

25

V

VBST

Voltage

21

V

Input voltage

–0.3

VDD 0.3

V

Power dissipation(3)

Internally limited

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are measured with respect to the ground pin, unless otherwise specified.

(3)

The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature,

TA. The maximum allowable power dissipation is PDMAX = (TJMAX –TA) / θJA or the given in Absolute Maximum Ratings, whichever is

lower.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

V(ESD)

Electrostatic discharge

±500

V

C101(2)

Machine Model(3)

±100

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

(3)

Machine model, applicable std. JESD22-A115-A.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

TA

Operating free-air temperature

–40

85

°C

VDD

Supply voltage

2.7

5.5

V

4

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