TPS730

SBVS054J – NOVEMBER 2004 – REVISED APRIL 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input range, VIN

–0.3

6

Voltage

Enable range, VEN

–0.3

6

V

Output range, VOUT

–0.3

6

Current

Peak output, IOUT(max)

Internally limited

Continuous total power dissipation

See Thermal Information

DBV package

–40

150

Junction, TJ

Temperature

YZQ package

–40

125

°C

Storage, Tstg

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±500

all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted).

MIN

NOM

MAX

UNIT

VIN

Input supply voltage

2.7

5.5

V

VEN

Enable supply voltage

0

VIN

V

VOUT

Output voltage

VFB

5

V

IOUT

Output current

0

200

mA

TJ

Operating junction temperature

–40

125

°C

CIN

Input capacitor

0.1

1

µF

COUT

Output capacitor

2.2(1)

10

µF

CNR

Noise reduction capacitor

0

10

nF

CFF

Feed-forward capacitor

15

pF

R2

Lower feedback resistor

30.1

k

Ω

(1)

If CFF is not used or VOUT(nom) < 1.8 V, the minimum recommended COUT = 4.7 µF.

6.4 Thermal Information

TPS73001

THERMAL METRIC(1)

DBV (SOT-23)

YZQ (DSBGA)

UNIT

6 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

225.1

178.5

RθJC(top)

Junction-to-case (top) thermal resistance

78.4

1.4

RθJB

Junction-to-board thermal resistance

54.7

62.1

°C/W

ψJT

Junction-to-top characterization parameter

3.3

0.9

ψJB

Junction-to-board characterization parameter

53.8

62.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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