COUT*

VOUT

VIN

GND PLANE

CIN*

Represents via used for

application specific connections

*not required

1

2

3

4

5

COUT*

VOUT

VIN

GND PLANE

CIN*

TLV733

Represents via used for

application specific connections

*not required

1

2

3

4

20

TLV733P

SBVS235C – OCTOBER 2014 – REVISED JULY 2019

www.ti.com

Product Folder Links: TLV733P

Submit Documentation Feedback

Copyright © 2014–2019, Texas Instruments Incorporated

9 Power Supply Recommendations

Connect a low output impedance power supply directly to the IN pin of the TLV733. Inductive impedances

between the input supply and the IN pin can create significant voltage excursions at the IN pin during startup or

load transient events. If inductive impedances are unavoidable, use an input capacitor.

10 Layout

10.1 Layout Guidelines

•

Place input and output capacitors as close to the device as possible.

•

Use copper planes for device connections, in order to optimize thermal performance.

•

Place thermal vias around the device to distribute the heat.

•

Do not place a thermal via directly beneath the thermal pad of the DQN package. A via can wick solder or

solder paste away from the thermal pad joint during the soldering process, leading to a compromised solder

joint on the thermal pad.

10.2 Layout Examples

Figure 39. Layout Example for the DQN Package

Figure 40. Layout Example for the DBV Package