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STM32U073RCT6 Datasheet(PDF) 120 Page - STMicroelectronics |
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STM32U073RCT6 Datasheet(HTML) 120 Page - STMicroelectronics |
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120 / 146 page ![]() 7.5 UFQFPN48 package information (A0B9) This UFQFPN is a 48-lead, 7 x 7 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package. Figure 41. UFQFPN48 - Outline D1 E1 EXPOSED PAD E2 e D2 PIN 1 idenfier BOTTOM VIEW L A A3 C FRONT VIEW DETAIL A SEATING PLANE LEADS COPLANARITY C ddd SEATING PLANE A1 A1 A C C ddd PIN 1 IDENTIFIER LASER MAKER AREA E D TOP VIEW 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the under side of the UFQFPN48 package. It is recommended to connect and solder this back-side pad to PCB ground. STM32U073x8/B/C Package information DS14548 - Rev 2 page 120/146 |
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