STM32U073RCT6 datasheet(126/146 Pages) STMICROELECTRONICS

126 / 146 page

Symbol

millimeters(1.)

inches (12.)

Min.

Typ.

Max.

Min.

Typ.

Max.

b(5.)

0.23

0.28

0.33

0.0090

0.0110

0.0130

D(6.)

5.00 BSC

0.1969 BSC

3.50 BSC

0.1378 BSC

5.00 BSC

0.1969 BSC

3.50 BSC

0.1378 BSC

e(9.)

0.50 BSC

0.0197 BSC

N(10.)

SD(11.)

0.25 BSC

0.0098 BSC

SE(11.)

0.25 BSC

0.0098 BSC

aaa

0.15

0.0059

ccc

0.20

0.0079

ddd

0.08

0.0031

eee

0.15

0.0059

fff

0.05

0.0020

Notes:

1. Dimensioning and tolerancing schemes conform to ASME Y14.5M-2009 apart European projection.

2. UFBGA stands for ultra profile fine pitch ball grid array: 0.50 mm < A ≤ 0.65 mm / fine pitch e < 1.00 mm.

3. The profile height, A, is the distance from the seating plane to the highest point on the package. It is measured

perpendicular to the seating plane.

4. A1 is defined as the distance from the seating plane to the lowest point on the package body.

5. Dimension b is measured at the maximum diameter of the terminal (ball) in a plane parallel to primary datum

6. BSC stands for BASIC dimensions. It corresponds to the nominal value and has no tolerance. For tolerances

refer to form and position table. On the drawing these dimensions are framed.

7. Primary datum C is defined by the plane established by the contact points of three or more solder balls that

support the device when it is placed on top of a planar surface.

8. The terminal (ball) A1 corner must be identified on the top surface of the package by using a corner chamfer,

ink or metallized markings, or other feature of package body or integral heat slug. A distinguish feature is

allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner

is optional.

9. e represents the solder ball grid pitch.

10. N represents the total number of balls on the BGA.

11. Basic dimensions SD and SE are defined with respect to datums A and B. It defines the position of the centre

ball(s) in the outer row or column of a fully populated matrix.

12. Values in inches are converted from mm and rounded to 4 decimal digits.

13. Drawing is not to scale

STM32U073x8/B/C

Package information

DS14548 - Rev 2

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