STM32U073RCT6 datasheet(133/146 Pages) STMICROELECTRONICS

133 / 146 page

Figure 50. UFBGA81 - Footprint example

Dsm

Dpad

Table 101. UFBGA81 - Example of PCB design rules (0.50 mm pitch BGA)

Dimension

Values

Pitch

0.50 mm

Dpad

0.250 mm

Dsm

0.300 mm typ. (depends on the soldermask registration

tolerance)

Stencil opening

0.356 mm aperture diameter

Stencil thickness

Between 0.100 mm and 0.125 mm

Pad trace width

0.120 mm

7.10

Package thermal characteristics

The operating junction temperature, TJ, must never exceed the maximum given in Section 6.3.1: General

operating conditions.

The maximum junction temperature in °C that the device can reach if respecting the operating conditions, is:

operating conditions, is:

TJmax=TAmax+ PDmax×ΘJA

where:

•

TAmax is the maximum ambient temperature, in °C.

•

ΘJA is the package junction-to-ambient thermal resistance, in °C/W.

•

PD=PINT+PI/O

–

PINT is the power dissipation contribution from product to IDD and VDD, expressed in Watts.

–

PI/O is the power dissipation contribution from output ports where:

PI/O= VOL×IOL + VDDIOx−VOH ×IOHtakingintoaccounttheactualVOL/IOLand

VOH/IOH of the I/Os at low and high level in the application.

Table 102. Package thermal characteristics

Symbol

Parameter

Package

Value

Unit

ΘJA

Thermal resistance junction-ambient

UFQFPN32

39.9

°C/W

WLCSP42

62.9

LQFP48

53.2

UFQFPN48

29.5

STM32U073x8/B/C

Package information

DS14548 - Rev 2

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