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MSP430 Datasheet(PDF) 94 Page - Texas Instruments |
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MSP430 Datasheet(HTML) 94 Page - Texas Instruments |
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94 / 96 page  www.ti.com EXAMPLE BOARD LAYOUT (1.475) 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND 32X (0.25) 32X (0.6) ( 0.2) TYP VIA 28X (0.5) (4.8) (4.8) (1.475) ( 3.45) (R0.05) TYP VQFN - 1 mm max height RHB0032E PLASTIC QUAD FLATPACK - NO LEAD 4223442/B 08/2019 SYMM 1 8 9 16 17 24 25 32 SYMM LAND PATTERN EXAMPLE SCALE:18X NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. 33 SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) |
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